Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Min Chih Hsuan0
Chang-Ming Lin0
Chi Shen Ho0
Kuolung Lei0
Date of Patent
November 28, 2006
0Patent Application Number
108154960
Date Filed
March 31, 2004
0Patent Primary Examiner
Patent abstract
A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions.
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