US Patent 7141875 Flexible multi-chip module and method of making the same
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Patent Inventor Names
Chang-Ming Lin0
Chi Shen Ho0
Kuolung Lei0
Min Chih Hsuan0
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Patent abstract
A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions.
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US Patent 07141875 Flexible multi-chip module and method of making the same US Patent 7141875 Flexible multi-chip module and method of making the same
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Patent Number
071418750
Patent Number
71418750
Edits on 6 Apr, 2023
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Patent Jurisdiction
Patent Number
071418750
Date of Patent
November 28, 2006
0Patent Application Number
108154960
Date Filed
March 31, 2004
0Official Website
Patent Primary Examiner
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US Patent 07141875 Flexible multi-chip module and method of making the same
Infobox
Is a
Patent jurisdiction
Patent number
07141875
Date of patent
November 28, 2006
Patent application number
10815496
Date Filed
March 31, 2004
Patent primary examiner
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