Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 12, 2006
Patent Application Number
10646157
Date Filed
August 22, 2003
Patent Primary Examiner
Patent abstract
A slurry and related method for chemical mechanical polishing (CMP) of a metal film includes a solution containing at one halide ion and at least one halogen species which react with the metal film to form a surface layer on the film. The surface layer formed can be a metal halide layer. The surface layer can be removed by abrasive particles embedded in the polishing pad, or a thin inorganic layer coated on the polishing pad.
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