US Patent 7148189 Chemical-mechanical polishing slurry for polishing metal films
Patent 7148189 was granted and assigned to University of Florida on December, 2006 by the United States Patent and Trademark Office.
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Patent abstract
A slurry and related method for chemical mechanical polishing (CMP) of a metal film includes a solution containing at one halide ion and at least one halogen species which react with the metal film to form a surface layer on the film. The surface layer formed can be a metal halide layer. The surface layer can be removed by abrasive particles embedded in the polishing pad, or a thin inorganic layer coated on the polishing pad.
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US Patent 07148189 Chemical-mechanical polishing slurry for polishing metal films US Patent 7148189 Chemical-mechanical polishing slurry for polishing metal films
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Patent Number
0714818900
Patent Number
714818900
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071481890
Date of Patent
December 12, 2006
0Patent Application Number
106461570
Date Filed
August 22, 2003
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071481890
Date of Patent
December 12, 2006
0Patent Application Number
106461570
Date Filed
August 22, 2003
0Official Website
Patent Primary Examiner
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US Patent 07148189 Chemical-mechanical polishing slurry for polishing metal films
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07148189
Date of patent
December 12, 2006
Patent application number
10646157
Date Filed
August 22, 2003
Patent primary examiner
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