US Patent 7150949 Further method to pattern a substrate
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Patent abstract
The present invention relates to methods for patterning substrates, such as reticles, masks or wafers, which reduce critical dimension variations, improving CD uniformity. In particular, it relates to tuning doses applied in passes of a multipass writing strategy to measurable characteristics of resists or radiation sensitive layers applied to the substrates. Particular writing strategies are described. Aspects of the present invention are described in the claims, specification and drawings.
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US Patent 07150949 Further method to pattern a substrate US Patent 7150949 Further method to pattern a substrate
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Patent Number
0715094900
Patent Number
715094900
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Patent Jurisdiction
Patent Number
071509490
Date of Patent
December 19, 2006
0Patent Application Number
109114120
Date Filed
August 4, 2004
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
071509490
Date of Patent
December 19, 2006
0Patent Application Number
109114120
Date Filed
August 4, 2004
0Official Website
Patent Primary Examiner
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US Patent 07150949 Further method to pattern a substrate
Infobox
Is a
Patent jurisdiction
Patent number
07150949
Date of patent
December 19, 2006
Patent application number
10911412
Date Filed
August 4, 2004
Patent primary examiner
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