Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yukio Ogawa0
Kazuhiro Kitagawa0
Kazuya Urata0
Kenji Hasegawa0
Date of Patent
January 2, 2007
0Patent Application Number
105176910
Date Filed
June 12, 2003
0Patent Primary Examiner
Patent abstract
The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.
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