US Patent 7157152 Copper-tin-oxygen alloy plating
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Patent Inventor Names
Kazuhiro Kitagawa0
Kazuya Urata0
Kenji Hasegawa0
Yukio Ogawa0
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Patent abstract
The present invention relates to a Cu—Sn—O alloy plating having an oxygen content of 0.3 to 50 at %, a copper content of 20 to 80 at %, and a tin content of 10 to 70 at % in the plating. The present invention provides a copper tin alloy plating that has excellent plating adhesion and disengaging force stability and particularly a Cu—Sn—O alloy plating that has a blackish color tone without containing any controlled substances.
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US Patent 07157152 Copper-tin-oxygen alloy plating US Patent 7157152 Copper-tin-oxygen alloy plating
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Patent Number
071571520
Patent Number
71571520
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Official Website
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Patent Jurisdiction
Patent Number
071571520
Date of Patent
January 2, 2007
0Patent Application Number
105176910
Date Filed
June 12, 2003
0Official Website
Patent Primary Examiner
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US Patent 07157152 Copper-tin-oxygen alloy plating
Infobox
Is a
Patent jurisdiction
Patent number
07157152
Date of patent
January 2, 2007
Patent application number
10517691
Date Filed
June 12, 2003
Patent primary examiner
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