Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mark Wilson0
David Garrett0
Date of Patent
January 23, 2007
0Patent Application Number
104589250
Date Filed
June 11, 2003
0Patent Primary Examiner
Patent abstract
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
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