US Patent 7166491 Thermoplastic fluxing underfill composition and method
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Patent Inventor Names
David Garrett0
Mark Wilson0
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Patent abstract
A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.
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US Patent 07166491 Thermoplastic fluxing underfill composition and method US Patent 7166491 Thermoplastic fluxing underfill composition and method
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Patent Number
071664910
Patent Number
71664910
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Patent Jurisdiction
Patent Number
071664910
Date of Patent
January 23, 2007
0Patent Application Number
104589250
Date Filed
June 11, 2003
0Official Website
Patent Primary Examiner
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US Patent 07166491 Thermoplastic fluxing underfill composition and method
Infobox
Is a
Patent jurisdiction
Patent number
07166491
Date of patent
January 23, 2007
Patent application number
10458925
Date Filed
June 11, 2003
Patent primary examiner
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