Golden has been acquired by ComplyAdvantage.Read about it here ⟶

‌

US Patent 7168484 Thermal interface apparatus, systems, and methods

Patent 7168484 was granted and assigned to Intel on January, 2007 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

0

Patent attributes

Current Assignee

0

Patent Jurisdiction

United States Patent and Trademark Office

0

Patent Number

Patent Inventor Names

Andrew A. Berlin0

Bryan M. White0

C. Michael Garner0

Paul A. Koning0

Valluri Rao0

Yuegang Zhang0

Date of Patent

January 30, 2007

0

Patent Application Number

106127110

Date Filed

June 30, 2003

0

Patent Citations Received

US Patent 12119275 Recessed lid and ring designs and lid local peripheral reinforcement designs

0

US Patent 11749631 Electronic package including a hybrid thermal interface material and low temperature solder patterns to improve package warpage and reliability

US Patent 12068225 System for cooling components in an electronic module

0

Patent Primary Examiner

0

Patent abstract

An apparatus and system, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the heat spreader.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 7168484 Thermal interface apparatus, systems, and methods

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Golden Query Tool