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US Patent 7168484 Thermal interface apparatus, systems, and methods

Patent 7168484 was granted and assigned to Intel on January, 2007 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12119275 Recessed lid and ring designs and lid local peripheral reinforcement designs
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Patent Citations Received
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US Patent 12068225 System for cooling components in an electronic module
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Patent Inventor Names
Andrew A. Berlin0
Bryan M. White0
C. Michael Garner0
Paul A. Koning0
Valluri Rao0
Yuegang Zhang0
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Patent abstract

An apparatus and system, may include a thermal interface material comprised of an array of carbon nanotubes and a buffer layer disposed between the thermal interface material and one of a die or a heat spreader. In some embodiments the carbon nanotubes may be formed above a buffer layer formed above a surface of the heat spreader.

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US Patent 07168484 Thermal interface apparatus, systems, and methods US Patent 7168484 Thermal interface apparatus, systems, and methods

Infobox
Patent Number
071684840
Patent Number
71684840
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=071684840
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Infobox
Is a
Patent
Patent
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
071684840
Date of Patent
January 30, 2007
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Patent Application Number
106127110
Date Filed
June 30, 2003
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=071684840
Patent Primary Examiner
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Tho Duong
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07168484
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 US Patent 07168484 Thermal interface apparatus, systems, and methods

Infobox
Is a
Patent
Patent
Current assignee
Intel
Intel
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07168484
Date of patent
January 30, 2007
Patent application number
10612711
Date Filed
June 30, 2003
Patent primary examiner
‌
Tho Duong

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