Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 30, 2007
Patent Application Number
10327870
Date Filed
December 24, 2002
Patent Primary Examiner
Patent abstract
System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness that corresponds to the solder. The solder and metal combination undergoes reflow for a period of time relative to the solder thickness. The resultant seal has a melting point at a temperature significantly greater than the melting temperature of the solder.
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