US Patent 7168608 System and method for hermetic seal formation
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Patent abstract
System and method for formation of a hermetic seal with an significantly greater melting temperature than the melting temperature of the solder employed. The hermetic seal is formed from a solder with a low melting point and a metal having a predetermined thickness that corresponds to the solder. The solder and metal combination undergoes reflow for a period of time relative to the solder thickness. The resultant seal has a melting point at a temperature significantly greater than the melting temperature of the solder.
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US Patent 07168608 System and method for hermetic seal formation US Patent 7168608 System and method for hermetic seal formation
Infobox
Patent Number
0716860800
Patent Number
716860800
Edits on 29 Apr, 2023
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Infobox
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Patent Jurisdiction
Patent Number
071686080
Date of Patent
January 30, 2007
0Patent Application Number
103278700
Date Filed
December 24, 2002
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
071686080
Date of Patent
January 30, 2007
0Patent Application Number
103278700
Date Filed
December 24, 2002
0Official Website
Patent Primary Examiner
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US Patent 07168608 System and method for hermetic seal formation
Infobox
Is a
Patent jurisdiction
Patent number
07168608
Date of patent
January 30, 2007
Patent application number
10327870
Date Filed
December 24, 2002
Patent primary examiner
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