US Patent 7173817 Front side hot-swap chassis management module

Patent 7173817 was granted and assigned to Intel on February, 2007 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

71738170

Patent Inventor Names

Wen Wei0

Date of Patent

February 6, 2007

Patent Application Number

107483850

Date Filed

December 29, 2003

Patent Primary Examiner

‌

Tuan Dinh

Patent abstract

A modular platform is provided. The modular platform includes a chassis having a front side and a back side, and configured to receive modular platform boards, a plenum associated with the chassis and at least one chassis management module removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum.

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