US Patent 7173817 Front side hot-swap chassis management module
Patent 7173817 was granted and assigned to Intel on February, 2007 by the United States Patent and Trademark Office.
All edits
Edits on 6 Sep, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Inventor Names
Wen Wei0
Edits on 31 Aug, 2023
Golden AI
Edits made to:
Article (+401 characters)
Article
Patent abstract
A modular platform is provided. The modular platform includes a chassis having a front side and a back side, and configured to receive modular platform boards, a plenum associated with the chassis and at least one chassis management module removably disposed in the at least one plenum in a substantially parallel relationship with a flow of a cooling medium passing through the plenum.
Edits on 22 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07173817 Front side hot-swap chassis management module US Patent 7173817 Front side hot-swap chassis management module
Infobox
Patent Number
071738170
Patent Number
71738170
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 27 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071738170
Date of Patent
February 6, 2007
0Patent Application Number
107483850
Date Filed
December 29, 2003
0Official Website
Patent Primary Examiner
Edits on 8 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 20 Nov, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07173817 Front side hot-swap chassis management module
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07173817
Date of patent
February 6, 2007
Patent application number
10748385
Date Filed
December 29, 2003
Patent primary examiner
Find more entities like US Patent 7173817 Front side hot-swap chassis management module
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
