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US Patent 7176506 High frequency chip packages with connecting elements

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
December 24, 2003
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Date of Patent
February 13, 2007
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Patent Application Number
10746810
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Patent Citations Received
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US Patent 12132161 Light-emitting device with metal inlay and top contacts
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US Patent 11756947 Light-emitting diode lighting system with wirebonded hybridized device
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US Patent 11875926 Inductor having high current coil with low direct current resistance
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US Patent 11942676 Single-package wireless communication device
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US Patent 11948724 Method for making a multi-thickness electro-magnetic device
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US Patent 11984396 Localized high density substrate routing
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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing
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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate
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US Patent 12107042 Localized high density substrate routing
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Patent Inventor Names
Teck-Gyu Kang
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Yoichi Kubota
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Glenn Urbish
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Jae M. Park
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Lee Smith
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Masud Beroz
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Michael Warner
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7176506
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Patent Primary Examiner
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Andy Huynh
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