Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tze Yang Hin0
Hideo Kageyama0
Seng Huat Lau0
Date of Patent
October 29, 2024
0Patent Application Number
181506730
Date Filed
January 5, 2023
0Patent Citations
...
Patent Primary Examiner
Patent abstract
Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.
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