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US Patent 8101967 Optical semiconductor package and optical semiconductor device

Patent 8101967 was granted and assigned to Panasonic on January, 2012 by the United States Patent and Trademark Office.

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Patent abstract

Leads 3 and a metal block 2 are resin molded only in a region surrounded by a base bottom 1d, and the surface of the metal block 2 at the bottom of a cavity 10 is not composed of a resin but a metallic component or a material having high resistance to discoloration and degradation.

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