US Patent 8101967 Optical semiconductor package and optical semiconductor device
Patent 8101967 was granted and assigned to Panasonic on January, 2012 by the United States Patent and Trademark Office.
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Patent abstract
Leads 3 and a metal block 2 are resin molded only in a region surrounded by a base bottom 1d, and the surface of the metal block 2 at the bottom of a cavity 10 is not composed of a resin but a metallic component or a material having high resistance to discoloration and degradation.
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Patent Inventor Names
Hiroshi Nakai0
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US Patent 08101967 Optical semiconductor package and optical semiconductor device US Patent 8101967 Optical semiconductor package and optical semiconductor device
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Patent Number
081019670
Patent Number
81019670
Edits on 26 Mar, 2023
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
081019670
Date of Patent
January 24, 2012
0Patent Application Number
130245820
Date Filed
February 10, 2011
0Patent Primary Examiner
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US Patent 08101967 Optical semiconductor package and optical semiconductor device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
08101967
Date of patent
January 24, 2012
Patent application number
13024582
Date Filed
February 10, 2011
Patent primary examiner
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