Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yutaka Iwata0
Hiroaki Satake0
Tetsuya Tanabe0
Yogo Kawasaki0
Date of Patent
February 20, 2007
0Patent Application Number
111066420
Date Filed
April 15, 2005
0Patent Primary Examiner
Patent abstract
Through holes 36 are formed to penetrate a core substrate 30 and lower interlayer resin insulating layers 50, and via holes 66 are formed right on the through holes 36, respectively. Due to this, the through holes 36 and the via holes 66 are arranged linearly, thereby making it possible to shorten wiring length and to accelerate signal transmission speed. Also, since the through holes 36 and the via holes 66 to be connected to solder bumps 76 (conductive connection pins 78), respectively, are directly connected to one another, excellent reliability in connection is ensured.
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