Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wai Kwan Wong0
Ee Hua Wong0
Mahadevan Krishna Iyer0
Ranjan Rajoo0
Date of Patent
February 20, 2007
0Patent Application Number
106670080
Date Filed
September 17, 2003
0Patent Primary Examiner
Patent abstract
A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.
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