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US Patent 7178711 Method and device to elongate a solder joint

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Edits on 6 Sep, 2023
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Patent Inventor Names
Ee Hua Wong0
Mahadevan Krishna Iyer0
Ranjan Rajoo0
Wai Kwan Wong0
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Patent abstract

A method and device to elongate a solder joint are provided. The method begins by forming an elongator on a first substrate. The elongator comprises an expander and an encapsulant to encapsulate the expander. A solder joint is formed to connect the first substrate to a second substrate. Thereafter, the encapsulant is softened to release the expander from a compressed state to elongate the solder joint. The device to elongate a solder joint comprises a substrate having an elongator formed on it. The elongator includes an expander in a compressed state and an encapsulant to encapsulate the expander.

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edited on 20 May, 2023
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US Patent 07178711 Method and device to elongate a solder joint US Patent 7178711 Method and device to elongate a solder joint

Infobox
Patent Number
071787110
Patent Number
71787110
Edits on 19 May, 2023
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edited on 19 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=071787110
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"Entity importer update"
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edited on 27 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
071787110
Date of Patent
February 20, 2007
0
Patent Application Number
106670080
Date Filed
September 17, 2003
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=071787110
Patent Primary Examiner
‌
Jonathan Johnson
0
Edits on 8 Jun, 2022
"Entity importer update"
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edited on 8 Jun, 2022
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07178711
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"Created via: Entity Importer"
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 US Patent 07178711 Method and device to elongate a solder joint

Infobox
Is a
Patent
Patent
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07178711
Date of patent
February 20, 2007
Patent application number
10667008
Date Filed
September 17, 2003
Patent primary examiner
‌
Jonathan Johnson

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