Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Satoshi Genda0
Kenji Furuta0
Nobuyasu Kitahara0
Ryugo Oba0
Toshiyuki Yoshikawa0
Date of Patent
February 20, 2007
0Patent Application Number
109863710
Date Filed
November 12, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.
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