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US Patent 7179723 Wafer processing method

Patent 7179723 was granted and assigned to Disco Corporation on February, 2007 by the United States Patent and Trademark Office.

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Patent Citations Received
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US Patent 12131952 Wafer dicing using femtosecond-based laser and plasma etch
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Patent Citations Received
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US Patent 11764061 Water soluble organic-inorganic hybrid mask formulations and their applications
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Patent Inventor Names
Kenji Furuta0
Nobuyasu Kitahara0
Ryugo Oba0
Satoshi Genda0
Toshiyuki Yoshikawa0
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Patent abstract

A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.

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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=071797230
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US Patent 07179723 Wafer processing method US Patent 7179723 Wafer processing method

Infobox
Patent Number
071797230
Patent Number
71797230
Edits on 25 Sep, 2022
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Infobox
Is a
Patent
Patent
0
Current Assignee
Disco Corporation
Disco Corporation
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
071797230
Date of Patent
February 20, 2007
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Patent Application Number
109863710
Date Filed
November 12, 2004
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=071797230
Patent Primary Examiner
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Michael Lebentritt
0
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Website URL
https://pdfpiw.uspto.gov/.piw?Docid=07179723
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 US Patent 07179723 Wafer processing method

Infobox
Is a
Patent
Patent
Current assignee
Disco Corporation
Disco Corporation
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
07179723
Date of patent
February 20, 2007
Patent application number
10986371
Date Filed
November 12, 2004
Patent primary examiner
‌
Michael Lebentritt

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