US Patent 7189287 Atomic layer deposition using electron bombardment

Patent 7189287 was granted and assigned to Micron Technology on March, 2007 by the United States Patent and Trademark Office.

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Patent

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Current Assignee

Micron Technology

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7189287

Patent Inventor Names

Neal R. Rueger0

Date of Patent

March 13, 2007

Patent Application Number

10879825

Date Filed

June 29, 2004

Patent Primary Examiner

‌

Robert Kunemund

Patent abstract

Formation of a layer of material on a surface by atomic layer deposition methods and systems includes using electron bombardment of the chemisorbed precursor.

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