US Patent 7189287 Atomic layer deposition using electron bombardment
Patent 7189287 was granted and assigned to Micron Technology on March, 2007 by the United States Patent and Trademark Office.
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Patent Inventor Names
Neal R. Rueger0
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Patent abstract
Formation of a layer of material on a surface by atomic layer deposition methods and systems includes using electron bombardment of the chemisorbed precursor.
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US Patent 07189287 Atomic layer deposition using electron bombardment US Patent 7189287 Atomic layer deposition using electron bombardment
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Patent Number
07189287
Patent Number
7189287
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US Patent 07189287 Atomic layer deposition using electron bombardment
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Is a
Current assignee
Patent jurisdiction
Patent number
07189287
Date of patent
March 13, 2007
Patent application number
10879825
Date Filed
June 29, 2004
Patent primary examiner
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