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US Patent 7195544 CMP porous pad with component-filled pores

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Patent Citations Received

US Patent 12023853 Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles

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US Patent 11986922 Techniques for combining CMP process tracking data with 3D printed CMP consumables

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US Patent 11980992 Integrated abrasive polishing pads and manufacturing methods

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US Patent 11964359 Apparatus and method of forming a polishing article that has a desired zeta potential

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US Patent 11958162 CMP pad construction with composite material properties using additive manufacturing processes

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US Patent 11878389 Structures formed using an additive manufacturing process for regenerating surface texture in situ

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Patent Citations Received

US Patent 11772229 Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process

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Patent Citations Received

US Patent 11745302 Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process

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Patent Inventor Names

Abaneshwar Prasad0

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Patent abstract

The invention provides a polishing pad comprising a polymeric material having pores and a component that is disposed within the pores, as well as a method of polishing a workpiece with the aforesaid polishing pad, and a method for producing the aforesaid polishing pad.

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Patent Citations Received

US Patent 11685014 Formulations for advanced polishing pads

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=071955440

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US Patent 07195544 CMP porous pad with component-filled pores US Patent 7195544 CMP porous pad with component-filled pores

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Patent Number

071955440

Patent Number

71955440

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edited on 27 Sep, 2022

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Is a

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

071955440

Date of Patent

March 27, 2007

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Patent Application Number

108070640

Date Filed

March 23, 2004

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=071955440

Patent Primary Examiner

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Edits on 8 Jun, 2022

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edited on 8 Jun, 2022

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Website URL

https://pdfpiw.uspto.gov/.piw?Docid=07195544

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created this topic on 20 Nov, 2021

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US Patent 07195544 CMP porous pad with component-filled pores

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Is a

Patent jurisdiction

United States Patent and Trademark Office

Patent number

07195544

Date of patent

March 27, 2007

Patent application number

10807064

Date Filed

March 23, 2004

Patent primary examiner

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