US Patent 7195954 Low capacitance coupling wire bonded semiconductor device
Patent 7195954 was granted and assigned to Texas Instruments on March, 2007 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device having reduced self and mutual capacitance of bonded wires is provided by coating the wires with a foamed polymer effectively having a very low dielectric constant. Additional benefits are realized by electrically insulating the wires against short-circuiting, by cushioning the wires with a low modulus sheath, and by protecting chip bond pad metallization
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Current Assignee
Patent Jurisdiction
Patent Number
71959540
Date of Patent
March 27, 2007
0Patent Application Number
108369490
Date Filed
May 3, 2004
0Patent Primary Examiner
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US Patent 07195954 Low capacitance coupling wire bonded semiconductor device US Patent 7195954 Low capacitance coupling wire bonded semiconductor device
Infobox
Patent Number
0719595400
Patent Number
719595400
Edits on 3 Apr, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071959540
Date of Patent
March 27, 2007
0Patent Application Number
108369490
Date Filed
May 3, 2004
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
071959540
Date of Patent
March 27, 2007
0Patent Application Number
108369490
Date Filed
May 3, 2004
0Official Website
Patent Primary Examiner
Edits on 8 Jun, 2022
Golden AI
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Website URL
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US Patent 07195954 Low capacitance coupling wire bonded semiconductor device
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07195954
Date of patent
March 27, 2007
Patent application number
10836949
Date Filed
May 3, 2004
Patent primary examiner
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