US Patent 7195954 Low capacitance coupling wire bonded semiconductor device
Patent 7195954 was granted and assigned to Texas Instruments on March, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
May 3, 2004
0
Date of Patent
March 27, 2007
0
Patent Application Number
10836949
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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