Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 3, 2007
Patent Application Number
11084985
Date Filed
March 21, 2005
Patent Primary Examiner
Patent abstract
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
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