US Patent 7199475 Semiconductor copper bond pad surface protection
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Patent abstract
Electronic packages with uninsulated portions of copper circuits protected with coating layers having thicknesses that are suitable for soldering without fluxing and are sufficiently frangible when being joined to another metal surface to obtain metal-to-metal contact between the surfaces.
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US Patent 07199475 Semiconductor copper bond pad surface protection US Patent 7199475 Semiconductor copper bond pad surface protection
Infobox
Patent Number
0719947500
Patent Number
719947500
Edits on 22 Apr, 2023
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071994750
Date of Patent
April 3, 2007
0Patent Application Number
110849850
Date Filed
March 21, 2005
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
071994750
Date of Patent
April 3, 2007
0Patent Application Number
110849850
Date Filed
March 21, 2005
0Official Website
Patent Primary Examiner
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US Patent 07199475 Semiconductor copper bond pad surface protection
Infobox
Is a
Patent jurisdiction
Patent number
07199475
Date of patent
April 3, 2007
Patent application number
11084985
Date Filed
March 21, 2005
Patent primary examiner
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