Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Naomi Kisu0
Emi Soshino0
Date of Patent
April 10, 2007
Patent Application Number
10418126
Date Filed
April 18, 2003
Patent Primary Examiner
Patent abstract
A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a circuit member-installing portion formed on and projecting from a front surface of a base mold. In the second step, a heated and softened panel material is laid on the front surface of the base mold. In the third step, the air between the panel material and the base mold is drawn via notch spaces and air-drawing holes.
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