US Patent 7201867 Method of installing circuit member in resin-molded panel

Patent 7201867 was granted and assigned to Yazaki on April, 2007 by the United States Patent and Trademark Office.

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Patent Inventor Names

Emi Soshino0

Naomi Kisu0

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Patent abstract

A method includes a first, a second and a third step, and a circuit member is installed in a resin-molded panel simultaneously when this resin-molded panel is vacuum formed. In the first step, the circuit member to be installed is placed on an upper surface of a circuit member-installing portion formed on and projecting from a front surface of a base mold. In the second step, a heated and softened panel material is laid on the front surface of the base mold. In the third step, the air between the panel material and the base mold is drawn via notch spaces and air-drawing holes.

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