Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Isao Ochiai0
Noriaki Sakamoto0
Date of Patent
April 24, 2007
0Patent Application Number
098213610
Date Filed
March 29, 2001
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Die pads 50, 51, an external connecting electrode 52 and a bridge are covered with an insulating resin after half-etching, formed into a single package without a coupling member such as a supporting lead or adhesive tape. In addition, since no supporting board is required, a low-profile semiconductor device with improved heat radiation can be provided.
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