US Patent 7208826 Semiconductor device and method of manufacturing the same

Patent 7208826 was granted and assigned to Sanyo on April, 2007 by the United States Patent and Trademark Office.

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US Patent 12113026 Multi-chip package and method of providing die-to-die interconnects in same

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US Patent 11876053 Multi-chip package and method of providing die-to-die interconnects in same

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Patent Inventor Names

Isao Ochiai0

Noriaki Sakamoto0

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Patent abstract

Die pads 50, 51, an external connecting electrode 52 and a bridge are covered with an insulating resin after half-etching, formed into a single package without a coupling member such as a supporting lead or adhesive tape. In addition, since no supporting board is required, a low-profile semiconductor device with improved heat radiation can be provided.

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=072088260

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