Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
May 1, 2007
Patent Application Number
11294986
Date Filed
December 6, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A support may receive one or more power electronic circuits. The support may aid in removing heat from the circuits through fluid circulating through the support. The support, in conjunction with other packaging features may form a shield from both external EMI/RFI and from interference generated by operation of the power electronic circuits. Features may be provided to permit and enhance connection of the circuitry to external circuitry, such as improved terminal configurations. Modular units may be assembled that may be coupled to electronic circuitry via plug-in arrangements or through interface with a backplane or similar mounting and interconnecting structures.
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