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US Patent 11758692 Heat dissipation module

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Inventor Names

Chien-Yu Chen

Yun-Kuei Lin

Chien-An Chen

Bo-Zhang Chen

Chun-Chi Lai

Wei-Hao Chen

Date of Patent

September 12, 2023

Patent Application Number

17195691

Date Filed

March 9, 2021

Patent Citations

US Patent 8467188 Modular heat-dissipating device

US Patent 8369090 Cooled electronic system

US Patent 8811016 Power converter device

US Patent 7212407 Electrical power converter method and system employing multiple output converters

US Patent 7616444 Gimballed attachment for multiple heat exchangers

Patent Primary Examiner

CPC Code

A heat dissipation module is provided and includes a cold plate having a housing, and a frame body disposed on the housing and having two sidewalls and at least one first rib, where the two sidewalls are positioned at two sides of the housing, respectively, and the first rib is used to provide a deformation resistance so that the heat dissipation module will not be seriously deformed when secured.

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