Patent attributes
A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member.
