US Patent 7224076 Electronic component package

Patent 7224076 was granted and assigned to Agere Systems on May, 2007 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Agere Systems

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

7224076

Date of Patent

May 29, 2007

Patent Application Number

11080859

Date Filed

March 15, 2005

Patent Primary Examiner

‌

Hoai Pham

Patent abstract

An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.

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