US Patent 7224076 Electronic component package
Patent 7224076 was granted and assigned to Agere Systems on May, 2007 by the United States Patent and Trademark Office.
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Patent abstract
An electronic component package and method of fabrication is provided. The electronic component package includes a ceramic substrate and a plurality of bonding pads formed on the substrate, each pad forming an interface with the ceramic. Formed on the bonding pads is a bonding material, and a plurality of electrical leads are secured to corresponding pads by the bonding material. A layer of adhesive is formed over at least the interfaces between the pads and ceramic.
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US Patent 07224076 Electronic component package US Patent 7224076 Electronic component package
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Patent Number
0722407600
Patent Number
722407600
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072240760
Date of Patent
May 29, 2007
0Patent Application Number
110808590
Date Filed
March 15, 2005
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
072240760
Date of Patent
May 29, 2007
0Patent Application Number
110808590
Date Filed
March 15, 2005
0Official Website
Patent Primary Examiner
Edits on 15 Jun, 2022
Golden AI
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Edits on 21 Nov, 2021
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US Patent 07224076 Electronic component package
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07224076
Date of patent
May 29, 2007
Patent application number
11080859
Date Filed
March 15, 2005
Patent primary examiner
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