Patent attributes
A laminated wiring board comprising:a first wiring board forming wiring layers on the upper surface and on the lower surface of a first ceramic insulated substrate; anda second wiring board forming wiring layers on the upper surface and on the lower surface of a second ceramic insulated substrate;the wiring layer on the lower surface of the first wiring board and the wiring layer on the upper surface of the second wiring board being connected together through connecting electrodes;wherein a coefficient α1 of thermal expansion of the first ceramic insulated substrate at 0 to 150° C. and a coefficient α2 of thermal expansion of the second ceramic insulated substrate at 0 to 150° C. are satisfying the following conditions:α1<α2α2−α1≦9×10−6/° C.
