US Patent 7226654 Laminated wiring board and its mounting structure
Patent 7226654 was granted and assigned to Kyocera Corporation on June, 2007 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 28, 2004
Date of Patent
June 5, 2007
Patent Application Number
10902677
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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