Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tohru Nakai0
Takeo Oki0
Naohiro Hirose0
Kouta Noda0
Honchin En0
Date of Patent
June 12, 2007
0Patent Application Number
097871390
Date Filed
September 14, 1999
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.
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