US Patent 7230188 Printed wiring board and its manufacturing method
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Patent Inventor Names
Honchin En0
Kouta Noda0
Naohiro Hirose0
Takeo Oki0
Tohru Nakai0
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Patent abstract
The present invention has for its object to provide a process for manufacturing multilayer printed circuit boards which is capable of simultaneous via hole filling and formation of conductor circuit and via holes of good crystallinity and uniform deposition can be constructed on a substrate and high-density wiring and highly reliable conductor connections can be realized without annealing.
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US Patent 07230188 Printed wiring board and its manufacturing method US Patent 7230188 Printed wiring board and its manufacturing method
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Patent Number
072301880
Patent Number
72301880
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Patent Jurisdiction
Patent Number
072301880
Date of Patent
June 12, 2007
0Patent Application Number
097871390
Date Filed
September 14, 1999
0Official Website
Patent Primary Examiner
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US Patent 07230188 Printed wiring board and its manufacturing method
Infobox
Is a
Patent jurisdiction
Patent number
07230188
Date of patent
June 12, 2007
Patent application number
09787139
Date Filed
September 14, 1999
Patent primary examiner
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