Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mie Matsuo0
Hisashi Kaneko0
Hirokazu Ezawa0
Date of Patent
July 3, 2007
0Patent Application Number
113484820
Date Filed
February 7, 2006
0Patent Citations Received
0
Patent Primary Examiner
Patent abstract
According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.
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