Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jong Oh Kwon0
Joo Ho Lee0
Kook Hyun Sunwoo0
Date of Patent
July 10, 2007
Patent Application Number
10980304
Date Filed
November 4, 2004
Patent Primary Examiner
Patent abstract
The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.
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