US Patent 7241966 Wafer level package fabrication method using laser illumination
Patent 7241966 was granted and assigned to Samsung on July, 2007 by the United States Patent and Trademark Office.
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Patent Inventor Names
Jong Oh Kwon0
Joo Ho Lee0
Kook Hyun Sunwoo0
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Patent abstract
The present invention relates to a WLP fabrication method capable of welding a lid wafer with a device wafer by using laser illumination. The WLP fabrication method can rapidly weld bonding metal strips of device and lid wafers with each other in order to couple the lid wafer with the device wafer while sealing an internal cavity from the outside without giving any thermal effect to a drive unit in the device wafer.
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US Patent 07241966 Wafer level package fabrication method using laser illumination US Patent 7241966 Wafer level package fabrication method using laser illumination
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Patent Number
07241966
Patent Number
7241966
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US Patent 07241966 Wafer level package fabrication method using laser illumination
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Is a
Current assignee
Patent jurisdiction
Patent number
07241966
Date of patent
July 10, 2007
Patent application number
10980304
Date Filed
November 4, 2004
Patent primary examiner
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