Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 24, 2007
Patent Application Number
10881340
Date Filed
June 30, 2004
Patent Primary Examiner
Patent abstract
An edge bead removal process is disclosed. The process includes providing a wafer having a feature layer, coating a photoresist on the feature layer, rotating the wafer, and removing an edge bead from the wafer by removing an edge bump portion from the edge bead and removing an edge region from the edge bead.
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