Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Masaharu Yoda0
Date of Patent
July 24, 2007
0Patent Application Number
107468200
Date Filed
December 23, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A mobile instrument includes two housings that each incorporate circuit substrates, a hinge portion that joins the two housings such that they can rotate, and a flexible printed wiring board that is passed through a cavity formed inside the hinge portion, and that electrically connects together the circuit substrates in the two housings. The flexible printed wiring board is curled inside the cavity and an elastic body is placed on an inner side of the curled flexible printed wiring board.
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