Patent 7248903 was granted and assigned to Kyocera Corporation on July, 2007 by the United States Patent and Trademark Office.
A mobile instrument includes two housings that each incorporate circuit substrates, a hinge portion that joins the two housings such that they can rotate, and a flexible printed wiring board that is passed through a cavity formed inside the hinge portion, and that electrically connects together the circuit substrates in the two housings. The flexible printed wiring board is curled inside the cavity and an elastic body is placed on an inner side of the curled flexible printed wiring board.